|
Journal/ Conference
|
Author/s |
Title of paper |
Link
|
| Journal of Physics D: Applied Physics |
Da He
et al. |
Effect of particle size ratio on the conducting percolation threshold of
granular conductive–insulating composites |
View Abstract |
| Rheologica Acta |
D. He et al. |
The Viscosity of Concentrated Non-Colloidal Bi-Disperse Suspensions |
View Abstract |
| Journal of Material Science: Material in Electronics |
R. Durairaj
et al. |
Thixotropy flow behaviour of solder and conductive adhesive pastes |
View Abstract |
| Journal of Material Science
& Engineering |
D. He et al. |
New Statistical Techniques for Evaluating Particle Packing Structures |
|
| Journal of Material Science & Engineering |
D. He et al. |
New
statistical technique for structure evaluation of particle packing |
View Abstract |
| Journal of Material Science: Materials in Electronics |
T. A. Nguty
et al. |
Modeling the Effects of Temperature on the Rheology of Solder Pastes and
Flux System |
View
Abstract
|
| Soldering and Surface Mount Technology |
B. Salam et al. |
Reflow profile study of the Sn-Ag-Cu solder |
View
Abstract |
| Soldering & Surface Mount Technology |
R. Durairaj
et al. |
Critical factors affecting paste flow during the stencil printing of solder
paste |
View Abstract |
| Soldering & Surface Mount Technology |
R. Durairaj
et al. |
Correlation of solder paste rheology with computational simulations of the
stencil printing process |
View Abstract |
| Korean Institute of Surface Engineering |
B. Salam et al. |
A study on the comparison of Solderability Assessment |
View Abstract |
| Journal IChEM |
N. N. Ekere
et al. |
The Structure of Concentrated Homogenous Suspensions |
|
| Journal of Rheology |
D. He et al. |
Modelling Wall Slip in Viscosity Measurement of Concentrated Suspensions
Using Parallel Plate Viscometer |
|
| IEEE Trans. Advanced Packaging |
G. J. Jackson
et al. |
Sub process challenges in ultra fine pitch stencil printing of type-6 and
type-7 Pb-free solder pasted for flip chip assembly applications |
View Abstract |
| IEEE Trans. Elec. Pack. & Manu |
G. J.
Jackson et al. |
Variation in behaviour of specifically designed fine particle Pb-free solder
pastes in the stencil printing and reflow process: A rheological explanation |
View Abstract |
| IEEE Trans. Comp. Pack. Man. Tech. Part A |
N. N. Ekere
et al. |
Computer Simulation of the Microstructure of Solder Pastes |
|
| IEEE Trans. Comp. Pack. Man. Tech. Part A |
D. He
et al. |
The Influences of Particle Size and Temperature on Wall Slip in Viscosity
Measurement of Concentrated suspensions |
|
| IEEE Trans. Comp. Pack. Man. Tech. Part A |
N. N. Ekere
et al. |
Effect of Particle Size Distributions on the Solder Paste Viscosity and on
the Stencil Printing Quality |
|
|
ECTC 0-7803-7038-4/01
|
B. Salam et al. |
Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free
Solders and the Effect of Solder Volume on Intermetallic Layer Formation.
|
View Abstract |
| 26th IEMT
Symposium 382-388 |
D. Rajkumar et al.
|
Optimising Process Parameters for Flip Chip
Stencil Printing Using Taguchi’s Method |
View Abstract |
| SSMT
12/3 35-38 |
T. A. Nguty et al.
|
Rework of CSP: the effect on surface intermetallic growth |
View Abstract |
| IEMT |
G. J. Jackson et al.
|
Characterisation of Lead-Free Solder Pastes for Low Cost
Flip-Chip Bumping |
View
Abstract |
| ESRF |
G. J. Jackson et al.
|
Solder joint assessment using X-ray diffraction at the ESRF:
A brief formalisation
|
View Abstract |
| IMAPS-UK MicroTech
conference |
Robert Kay et al. |
Low temperature flip-chip packaging based on stencil printing technology |
View Abstract |
| |
Robert Kay et al. |
Advanced microsystems assembly using screen printing technology |
View Abstract |
| VDE Microtec conference |
Robert Kay et al. |
A high volume, low cost and low temperature MEMS packaging technology based
on a flip-chip assembly process |
|
| Solder
and surface mount technology |
S.
R. Hillman et al. |
Correlation
between jamming and skipping during solder paste printing |
View
Abstract |
| Journal
of Electronic Material |
G.
J. Jackson et al. |
Intermetallic
phase detection in Lead-Free Solders using Synchrotron X-Ray diffraction |
View
Abstract |
| Journal
of Materials Science |
D.
He et al. |
Monte
Carlo study of solder paste microstructure and ultra fine pitch stencil
printing |
View
Abstract |
| Journal
of Materials Science |
D.
He et al. |
Computer
simulation of powder compaction of spherical particles |
View
Abstract |
| 50th
Electronic Comp. Technology Conference |
D.
He et al. |
A
Study of Solder Paste Flow inside a Sealed Printing Head |
View
Abstract |
| Physical
Review E |
D.
He et al. |
Two
dimensional percolation and cluster structure of the random packing of
binary discs |
View
Abstract |
| IEEE
Trans. Components and Packaging Technologies |
D.
He et al. |
Influence
of wall slip in the measurement of solder paste viscosity |
View
Abstract |
| AIChE
Journal |
D.
He et al. |
Structure
simulation of Concentrated Suspensions of Hard Spherical Particles |
View
Abstract |
| Physical
Review E |
D.
He et al. |
Computer
Simulation of random packing of unequal particles |
View
Abstract |
| IEEE
Trans. Comp. Pack. Manuf. Tech. |
D.
He et al. |
The
behaviour of solder pastes in stencil printing with vibrating squeegee |
View
Abstract |
| IEEE/CPMT
Int. Elec. Manuf. Tech. symposium 23 |
D.
He et al. |
Viscoelastic
characteristics of solder pastes under high frequency oscillatory shear |
View
Abstract |
| IEEE/CPMT
Int. Elec. Manuf. Tech. symposium 21 |
D.
He et al. |
Study
of the response of solder paste under vibration |
View
Abstract |
