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EMERG
School of Engineering
University of Greenwich
Medway Campus
Chatham Maritime
Kent, ME4 4TB
Tel: +44(0)1634 883557

Fax: +44(0)1634 883156

E-mail: n.j.cox@gre.ac.uk

 

 

 

 

 

 

 

 

 

 

 

 

Journal/ Conference

 

Author/s

Title of paper

Link

Journal of Physics D: Applied Physics Da He et al. Effect of particle size ratio on the conducting percolation threshold of granular conductive–insulating composites

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Rheologica Acta D. He et al. The Viscosity of Concentrated Non-Colloidal Bi-Disperse Suspensions

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Journal of Material Science: Material in Electronics R. Durairaj et al. Thixotropy flow behaviour of solder and conductive adhesive pastes

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Journal of Material Science & Engineering D. He et al. New Statistical Techniques for Evaluating Particle Packing Structures  
Journal of Material Science & Engineering D. He et al. New statistical technique for structure evaluation of particle packing

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Journal of Material Science: Materials in Electronics T. A. Nguty et al. Modeling the Effects of Temperature on the Rheology of Solder Pastes and Flux System

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Soldering and Surface Mount Technology B. Salam et al. Reflow profile study of the Sn-Ag-Cu solder

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Soldering & Surface Mount Technology R. Durairaj et al. Critical factors affecting paste flow during the stencil printing of solder paste

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Soldering & Surface Mount Technology R. Durairaj et al. Correlation of solder paste rheology with computational simulations of the stencil printing process

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Korean Institute of Surface Engineering B. Salam et al. A study on the comparison of Solderability Assessment

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Journal IChEM N. N. Ekere et al. The Structure of Concentrated Homogenous Suspensions  
Journal of Rheology D. He et al. Modelling Wall Slip in Viscosity Measurement of Concentrated Suspensions Using Parallel Plate Viscometer  
IEEE Trans. Advanced Packaging G. J. Jackson et al. Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pasted for flip chip assembly applications

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IEEE Trans. Elec. Pack. & Manu G. J. Jackson et al. Variation in behaviour of specifically designed fine particle Pb-free solder pastes in the stencil printing and reflow process: A rheological explanation

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IEEE Trans. Comp. Pack. Man. Tech. Part A N. N. Ekere et al. Computer Simulation of the Microstructure of Solder Pastes  
IEEE Trans. Comp. Pack. Man. Tech. Part A D. He  et al. The Influences of Particle Size and Temperature on Wall Slip in Viscosity Measurement of Concentrated suspensions  
IEEE Trans. Comp. Pack. Man. Tech. Part A N. N. Ekere et al. Effect of Particle Size Distributions on the Solder Paste Viscosity and on the Stencil Printing Quality  

ECTC       0-7803-7038-4/01

 

B. Salam et al.

Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation.

 

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26th IEMT Symposium 382-388

D. Rajkumar et al.

 

Optimising Process Parameters for Flip Chip Stencil Printing Using Taguchi’s Method

 

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SSMT 12/3 35-38

T. A. Nguty et al.

 

Rework of CSP: the effect on surface intermetallic growth

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IEMT

G. J. Jackson et al.

 

Characterisation of Lead-Free Solder Pastes for Low Cost Flip-Chip Bumping

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ESRF

G. J. Jackson et al.

 

Solder joint assessment using X-ray diffraction at the ESRF: A brief formalisation

 

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IMAPS-UK MicroTech conference Robert Kay et al. Low temperature flip-chip packaging based on stencil printing technology

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  Robert Kay et al. Advanced microsystems assembly using screen printing technology

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VDE Microtec conference Robert Kay et al. A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process  
Solder and surface mount technology S. R. Hillman et al. Correlation between jamming and skipping during solder paste printing

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Journal of Electronic Material G. J. Jackson et al. Intermetallic phase detection in Lead-Free Solders using Synchrotron X-Ray diffraction

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Journal of Materials Science D. He et al. Monte Carlo study of solder paste microstructure and ultra fine pitch stencil printing

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Journal of Materials Science D. He et al. Computer simulation of powder compaction of spherical particles

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50th Electronic Comp. Technology Conference D. He et al. A Study of Solder Paste Flow inside a Sealed Printing Head

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Physical Review E D. He et al. Two dimensional percolation and cluster structure of the random packing of binary discs

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IEEE Trans. Components and Packaging Technologies D. He et al. Influence of wall slip in the measurement of solder paste viscosity

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AIChE Journal D. He et al. Structure simulation of Concentrated Suspensions of Hard Spherical Particles

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Physical Review E D. He et al. Computer Simulation of random packing of unequal particles

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IEEE Trans. Comp. Pack. Manuf. Tech. D. He et al. The behaviour of solder pastes in stencil printing with vibrating squeegee

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IEEE/CPMT Int. Elec. Manuf. Tech. symposium 23 D. He et al. Viscoelastic characteristics of solder pastes under high frequency oscillatory shear

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IEEE/CPMT Int. Elec. Manuf. Tech. symposium 21 D. He et al. Study of the response of solder paste under vibration

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