MAT21: Microsystems Assembly Technology for
21st Century
This multi-disciplinary project seeks to establish the next generation of
Microsystems Assembly Technology for the 21st century. It aims to
produce micro-engineered interconnections of geometry one order of magnitude
less than is currently available... read more |
Characterisation
and Modelling
of the Rheology of Solder
pastes
Solder paste is the primary
joining medium in the assembly of surface mounted electronic devices, and
solder paste printing is a crucial and error-prone step in the assembly
process. An improved understanding of solder paste properties would allow
better control...
read more
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Key Milestones
Low Cost Flip-Chip Assemblies
Solder paste is the primary joining medium used in the assembly of
electronic devices. The contemporary technology available in the industry
can only print down to 150 micron, because the paste materials are not
designed for deposition and reflow below the 150micron limit... read more
|
