|
Awarding Body |
Project Title |
Value |
|
EPSRC GR/04302873 |
Rheological
Characterisation of lead-free solder paste formulations. |
£65,000 |
|
EPSRC GR/R09190 |
Micro Assembly
Technology for 21st Century |
£380,000 |
|
EPSRC GR/L59320 |
Characterisation and
Modeling of the dense suspensions
Rheology of Solder Paste. |
£203,147 |
|
ESRF ME532 on ID11 |
Temperature resolved
micro structural characterisation of lead free solder joints using
fine-focus x-ray diffraction. |
£33,000 |
|
ESRF ME361 on ID11 |
Detection and
characterisation of intermetallic compounds in
Pb-free solder joints using high energy
micro-focus x-ray diffraction. |
£33,000 |
|
Korea UK DTI Science & Tech fund |
A study of
fluxless micro-soldering for MEMS. (Joint
Project with Univ. of Seoul) |
£30,000 |
|
EPSRC GR/H39239 |
Modelling of Solder
Paste Printing for the Reflow Soldering of Surface-Mounted Components. |
£94,069 |
|
EPSRC GR/K76542 |
ASPMIC: Automatic
Solder Paste Monitoring, Inspection and Control. |
£83,347 |
|
EPSRC GR/L20597 |
Characterisation and
Modelling of the Rheology of Solder Pastes. |
£136,603 |
|
EPSRC GR/L59320 |
Characterisation and
Modelling of the Rheology of Solder Pastes. |
£203,147 |
|
EPSRC GR/L66113 |
Chip-Scale Soldering
studies based upon the processing of low cost Flip-Chip Assemblies. |
£143,916 |
|
EPSRC GR/M39848/01 |
R-COMPAS Rapid
Configuration of Manufacturing Processes for Agile Supply-Chains. |
£146,041 |
